basic six
1. Impact resistance
Crystal products may be damaged under certain conditions. Such as being dropped from a table or subjected to shock during placement. Do not use if product has been impacted.
2. Radiation
Exposure to radiation can result in compromised product performance and should therefore be kept away from radiation.
3. Chemical agent / pH value environment
Do not use or store these products in an environment where the pH range may cause corrosion or dissolution of the product or packaging materials.
4. Adhesive
Do not use adhesives that may corrode the packaging materials, terminations, assemblies, glass materials, and vapor deposition materials used in the product. (For example, chlorine-based adhesives can corrode the metal "lid" of a crystal unit, destroying seal quality and reducing performance)
5. Halogen compounds
Do not use the product in a halogen atmosphere. Even small amounts of halogen gases, such as in chlorine in the air or in metal parts used in packaging, can cause corrosion. Also, do not use any resins that emit halogen gases.
6. Static electricity
Excessive static electricity may damage the product, please pay attention to anti-static conditions. Select conductive materials for container and packaging materials. When handling, use a welding torch and a measurement circuit free of high voltage leakage, and perform grounding operations.
Design considerations
Effects of Mechanical Vibration
When there is any given shock or periodic mechanical vibration on crystal products, such as piezoelectric speakers, piezoelectric buzzers, and horns, the output frequency and amplitude are affected. This phenomenon has an impact on the communication quality of the communication equipment. Although crystal products are designed to minimize the effects of this mechanical vibration, we recommend prior inspection and following installation guidelines.
PCB Design Guidelines
Ideally, the mechanical buzzer should be mounted on a separate PCB from the crystal device. If you are mounting on the same PCB board, it is better to use the margin or cut the PCB. The degree of mechanical vibration varies when applied to the PCB itself or inside the PCB body. It is recommended to follow the internal board characteristics. Please refer to the corresponding recommended package when designing. When using solder flux, use it according to JIS standard (JIS C 60068-2-20/IEC 60,068-2-20). Please use lead-free solder according to JIS standard (JIS Z 3282, Pb content 1000ppm, 0.1wt% or less).
Storage Matters
1. Temperature
Storing crystal products for extended periods of time at higher or lower temperatures or high humidity can affect frequency stability or solderability. Please store these crystal products in a normal temperature and humidity environment, and install as much as possible after opening to avoid long-term storage.
Normal temperature and humidity: Temperature: +15 ℃ to +35 ℃, humidity 25 % RH to 85 % RH (refer to "Standard Conditions for Test Points JIS C 60068-1 / IEC 60068-1" section).
2. Packaging
Please handle the inner and outer boxes and reel carefully. External pressure can cause damage to the reel.
Precautions during installation
1. Welding resistance
Except for SMD products, other crystal products use solders with melting point of +180°C to +200°C. Heating the encapsulation material above +150°C will destroy product characteristics or damage the product. If you need to solder crystal products above +150℃, it is recommended to use SMD products. Under the following reflow conditions, using higher temperatures for crystalline products or even SMD products will destroy product characteristics.
The reflow conditions for the following configurations are recommended. Before installing these products, the soldering temperature and time should be checked. Also, in the event of a change in the installation conditions, please check again. If the crystal products to be soldered are soldered in the following configurations, please contact us for information on heat resistance.
2. Shock during automatic installation
Shock caused by automatic installation and vacuuming can destroy product characteristics and affect these products. Please set installation conditions to minimize shock as much as possible, and ensure that product characteristics are not affected prior to installation. When the conditions change, please recheck the installation conditions. At the same time, before and after installation, please make sure that the crystal product does not hit the machine or other circuit boards, etc.
Considerations for each package type
1. Ceramic package products and SON products
After soldering ceramic packaged products and SON products (MC-146, RTC-****NB, RX-****NB), bending the circuit board can cause peeling of the soldered portion or splitting (cracking) of the package due to mechanical stress. Especially when cutting boards after soldering these products, it is important to ensure that the crystals are laid out in less stressful locations and that less stressful cutting methods are used. Ceramic package products When soldering ceramic package products on a circuit board (glass epoxy) with different expansion coefficients, the terminal welding part may break when the temperature changes repeatedly for a long time. Please check the welding characteristics in advance.
2. Cylindrical products
Bending the lead directly or pulling the lead forcibly on the glass portion of the product can cause splitting (cracking) of the sealing glass at the root of the lead, and may also result in damage to air tightness and product characteristics. When the lead of the crystal product needs to be bent into the shape shown in the figure below, the lead of 0.5mm should be reserved and supported in this scenario to avoid splitting. When the pin needs to be repaired, do not stretch it, hold the bent part for repair. Applying a certain pressure to this sealing portion will result in damage to the airtightness. So please don't stress here. In addition, in order to avoid fatigue cutting of pins caused by machine resonance, it is recommended to use adhesive to fix the product on the fixed circuit board.
Installation example
3. DIP product/Pin OCXO
Deformed pins cannot be inserted into board holes. Do not apply excessive pressure to avoid deformation of the pins.
4. SOJ products and SOP products
Do not apply excessive pressure to avoid deformation of the pins. Deformed pins can float when soldered. Especially SOP products need to be handled with more care.
cleaning
1. Ultrasonic cleaning
Products using AT-cut crystals and surface acoustic wave (SAW) resonators/filters can be cleaned by ultrasonic. However, under certain conditions, crystal characteristics may be affected and internal wiring may be damaged. Make sure you have checked the suitability of the system beforehand. Products using tuning fork crystals and gyroscope sensors and OCXOs cannot be guaranteed to be cleaned by ultrasonic methods because the crystals may be damaged.
2. Do not clean open products
For washable products, avoid the use of cleaning agents or solvents, etc. that may negatively affect the product. Solder flux residues can absorb moisture and solidify. This can cause other phenomena such as displacement. This will negatively affect the reliability and quality of the product. Please clean the residual flux and dry the PCB.
operate
Do not use tweezers or any hard tool, the fixture directly touches the surface of the IC.
Use environment (temperature and humidity)
Please use the product within the specified temperature range. This temperature relates to the bulk and seasonally varying temperatures. In a high humidity environment, it may malfunction due to condensation. Please avoid condensation.
